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MEASUREMENT



                                                                  Designing a good mechanical enclosure for MEMS
                                                               accelerometers requires an understanding of modal analysis.
                                                               Modal analysis provides the natural frequencies in the axis of
                                                               interest for a vibration sensor enclosure. In addition, the mode
                                                               participation factor (MPF) will enable the designer to decide if a
                                                               frequency can be ignored in a design.
                                                                  Both material characteristics and geometry need to be
                                                               considered when designing a vibration sensor enclosure to meet
                                                               natural frequency targets. Enclosure height needs to be minimised
                                                               to achieve higher natural frequencies. Reducing wall thickness or
                                                               enclosure diameter both have secondary effects on the enclosure
                                                               natural frequencies.
                                                                  Cylindrical shapes with higher cross-sectional areas are better
                                                               designed for higher rigidity and natural frequencies across all axes,
                                                               compared to rectangular shapes. Rectangular shapes offer more
                                                               options in sensor orientation and equipment attachment, compared
        Figure 28. Effect of mounting technique on sensor resonance.
                                                               to cylindrical shapes. Rectangular shapes are useful in maintaining
                                                               similar natural frequency performance across three axes.
                                                                  For most cases, adding epoxy resin will aid the natural
                                                               frequency performance for a vibration sensor enclosure solution.
                                                               Using stud or adhesive mounting provides the best usable
                                                               frequency range for a vibration sensor, while using magnetic or
                                                               adhesive pads reduces sensor performance.        n

                                                               References
                                                               1.  ANSYS Innovation Courses: Modal Analysis. ANSYS, 2021.
        Figure 29. Mounting techniques for vibration sensors.  2.  Stephen Timoshenko. Vibration Problems in Engineering, 4th
                                                                  edition. John Wiley and Sons Inc., New York, 1974.
        performed using the default bonded contact constraint. This is where   3.  Leszek Majkut. “Free and Forced Vibrations of Timoshenko Beams
        the bottom of the vibration sensor – and, in particular, the ¼”-28-  Described by Single Difference Equation.” Journal of Theoretical
                                                                  and Applied Mechanics, Vol. 47, No. 1, January 2009.
        inch mounting hole – is designated as a fixed constraint using ANSYS.   4.  Mohammad Hossein Abolbashari, Somayeh Soheili, and Anoshirvan
        The constraint type is default bonded or a bolted connection.  Farshidianfar. “Flexural Vibration of Propeller Shafts Using
           Simulation of adhesive contact is an advanced topic    Distributed Lumped Modeling Technique.” The 16th International
        and requires ANSYS cohesive zone modeling (CZM) and an    Congress on Sound and Vibration, Krakow, 2009.
        understanding of contact mechanics. For accuracy, the ANSYS CZM   5.  Saida Hamioud and Salah Khalfallah. “Spectral Element Analysis
        requires parameters input based on lab test data. For example,   of Free - Vibration of Timoshenko Beam.” International Journal of
        the article “Direct Measurement of the Cohesive Law of Adhesives   Engineering, 2018.
                                            8
        Using a Rigid Double Cantilever Beam Technique”  can be used   6.  Olivier A. Bauchau and James I. Craig. Structural Analysis: With
        for inputs to ANSYS. If you don’t find experimental data published   Applications to Aerospace Structures, Springer, 2009.
        for your chosen adhesive, then you will need to do some lab   7.  TN17: Installation of Vibration Sensors, Wilcoxon Sensing
                                                                  Technologies, 2018.
        measurements. In addition, the correct contact formulation needs   8.  A. Khayer Dastjerdi, E. Tan, and F. Barthelat. “Direct Measurement
        to be set up in ANSYS, with guidance provided in short courses   of the Cohesive Law of Adhesives Using a Rigid Double Cantilever
                                    9
        such as Fundamental Topics in Contact.  Finally, the CZM and modal   Beam Technique.” Society for Experimental Mechanics, May 2013.
        techniques then need to be combined within the ANSYS workbench.  9.  ANSYS Innovation Courses: Fundamental Topics in Contact.
           ANSYS Maxwell  can be used to simulate magnetic fields. However,   ANSYS, 2021.
                     10
        as magnetic forces are non-contact forces (they push or pull objects   10.  Ansys Maxwell: Low Frequency EM Field Simulation. ANSYS, 2021.
        without “solid” contact), generating an appropriate contact constraint
        for numerical modal analysis is not possible. Modal analysis can be   About the Author
        performed with bonded, frictionless, frictional, and no separation   Richard Anslow is system applications engineer with the
        contacts. CZM contact may also be possible, as mentioned previously.  Connected Motion and Robotics Team within the Automation
                                                               and Energy Business Unit at Analog Devices. His areas of
        Conclusion                                             expertise are condition-based monitoring and industrial
        A good mechanical enclosure design for a MEMS accelerometer   communication design. He received his B.Eng. and M.Eng.
        will ensure that high quality vibration data for CbM is extracted   degrees from the University of Limerick, Limerick, Ireland. He can
        from the monitored asset.                              be reached at richard.anslow@analog.com.



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