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INDUSTRY, TECHNOLOGY, PRODUCTS and INNOVATION you want to read about

Space partnership between SANSA Dupont Microcircuit

and UK Space Agency formalised at Materials introduces

IAC 2021 new silver pastes for
In-Mold electronics

t the world’s largest space conference, the International Astronautical Congress (IAC)
Acurrently taking place in Dubai (25-29 October 2021), saw representatives from the
South African National Space Agency (SANSA) and United Kingdom Space Agency (UKSA) Advanced thick film paste
take the opportunity to formally sign the Memorandum of Understanding (MoU) between formulations designed to improve
Agencies for the benefit of both countries’ citizenry. thermoformability, conductivity and
The MoU forges a framework for collaborative activities that includes but is not
limited to the sharing of satellites and data for Earth observation purposes, collaboration fine line performance
on space applications addressing climate change, the fostering of research partnerships in
space science and technology (special focus on space weather), connecting and supporting
local space businesses and providing national space infrastructure development support uPont introduced an advanced suite of silver
as required. Dbearing thick film paste conductors to enable In-
“The development of a MoU began a few years ago with a visit to the UK by SANSA Mold electronic devices. The new conductors, ME102,
and industry delegations to identify partnership opportunities. All of us at the British ME604 and ME614, have key advancements to
High Commission in South Africa are delighted to see this result and look forward to improve thermoformability, conductivity and fine line
collaborating with our South African partners on a range of mutually beneficial scientific performance. These offerings enable high productivity
and commercial programmes,” said Anthony Phillipson, British High Commissioner to and improved mechanical and electrical properties,
South Africa. allowing extended freedom in the electronic design
The two agencies have in the past been involved in some space projects and the MoU of In-Mold Electronics devices. These devices include
serves to now formalise and enhance the opportunities for a stronger partnership that next generation LiDAR systems for autonomous driving
serves all stakeholders in the space value chain. or touch steering wheels with transparent 3D shaped
“Global partnerships are necessary for the sustainability and success of space surfaces for enhanced user experience.
programmes and SANSA appreciates and commits to exploring opportunities to
contribute towards this mutually beneficial collaboration with our colleagues in the UK,” Key advancements of the new ME range include:
said Dr Val Munsami, SANSA CEO. • ME102 as a highly conductive thick film paste for
United Kingdom Space Agency chief executive Dr Paul Bate said: “This partnership antennas, heater and RFID functions
will increase the sharing of knowledge, talent, research and innovation between the UK • ME604 as a general-purpose thick film conductive
and South Africa, with all the scientific and commercial opportunities this brings. Space is paste with improved thermoformability and
an effective tool in the fight against climate change and as we approach COP26, we must conductivity
work across borders to reach our shared goal of achieving net-zero by 2050. • ME614 thick film conductive paste with added
“As set out in the UK’s National Space Strategy, we are committed to strengthening laser ablation property for very fine line
our international relationships and building the UK’s reputation as a partner of choice in applications
space activities.”
“This innovative new offering demonstrates a range
of superior technical properties to meet different
customer requirements. “We are excited to introduce
the ME product range to the market globally and
expect a positive impact in accelerating the wider
adoption of the emerging In-Mold Electronics
technology”, said Peter Weigand, global automotive
segment manager, DuPont Microcircuit Materials.
DuPont continues to invest in research,
development and intellectual property involving
In-Mold paste technology to address customer
needs in this growing market. DuPont Microcircuit
Materials has over 50 years of experience in the
development, manufacture, sale and support of
specialised thick film paste compositions for a wide
variety of electronic applications in the display,
automotive, biomedical, industrial, military and
telecommunications markets.

For more information on DuPont Microcircuit
Dr Val Munsami (SANSA) and Dr Paul Bate (UKSA) Materials, please visit http://mcm.dupont.com

EngineerIT | November 2021 | 48