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ADVANCED FILTER TECHNOLOGY


























        Figure 9: The group delay flatness affects the deviation from the linear phase: (a) showing 2.24 ns group delay flatness vs. (b) showing 0.8 ns flatness
        resulting in more consistent phase change vs. frequency.


        Traditional filter technologies for RF communications     periodic characteristics. In some cases, lumped components
        When designing a filter for RF communications systems, there are   are added to improve/miniaturise the distributed filter.
        a variety of technologies available to implement the classical filter   •  Ceramic resonator filters use multiple ceramic resonators
        types. Traditionally, RF engineers relied upon discrete lumped   (which are a distributed element) that are coupled via
        element implementations with surface-mount components or   lumped elements. The coupling element is typically a
        distributed element filters containing transmission lines printed on   capacitor but sometimes inductors are also used. This type of
        PCB materials. However, in recent years, filters have been designed   filter is a hybrid of distributed and lumped elements.
        on semi-conductor processes that allow for precise temperature   •  Cavity filters are implemented with distributed elements
        stable reactive components with improved quality factors.   (rods) enclosed within a conducting box. They are known for
        Additionally, the semi-conductor processes allow for switched   being able to handle high amounts of power with little loss
        and tunable reactive elements that can be more challenging to   but at the expense of size and cost.
        implement in the discrete lumped element implementations.   •  BAW and SAW technologies can provide excellent
        There are other technologies as well, such as the bulk acoustic   performance but they tend to be frequency selective and not
        wave (BAW), surface acoustic wave (SAW), low temperature co-  suitable for wideband applications.
        fired ceramic (LTCC), cavity filters, or ceramic resonators.  •  LTCC filters are implemented by combining many layers of
                                                                  distributed transmission lines within a ceramic package,
        Trade-offs exist with each approach and technology:       which is similar to a distributed filter and can serve a number
        •  Lumped LC filters are implemented with surface-mount   of applications but are fixed. Since they are 3D stacked, they
           inductors and capacitors on a PCB. The benefit is the ease of   end up taking little space on the PCB.
           assembling and then changing the performance of the filter   •  Lastly, filters integrated into semiconductors support a wide
           by swapping out values.                                frequency range with recent advances in semi-conductor
        •  Distributed filters are designed as resonant pieces of a   performance. The ability to easily integrate digital control
           transmission line implemented on a dielectric (either   elements into these components aids in the adoption into
           integrated into the PCB or standalone on a separate    software-defined transceivers. In general, the trade-off
           dielectric) and are oriented to behave as quasi-inductors   between performance and integration provides a compelling
           or quasi-capacitors in some frequency range. They exhibit   value to designers of wideband systems.



         Table 1: Filter type comparison
                           Frequency Range   Tunability            Size           Cost           Q-factor
         Lumped LC         <6 GHz           Difficult to implement   Medium       $              Medium
         Distributed       <50 GHz          Fixed                  Medium         $$             Medium/high
         Ceramic Resonator   <6 GHz         Fixed                  Large          $$             High
         Cavity            <40 GHz          Fixed                  Large          $$$            High
         SAW/BAW           <6 GHz           Fixed                  Small          $              High
         LTCC              <40 GHz          Fixed                  Small          $              Medium
         Semiconductor     <50 GHz          Digital tuning integrated   Small     $$             Medium




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