Page 17 - EngineerIT October 2022
P. 17

ELECTRONICS


        Power supply block                                     •  For easier implementation, decoupling capacitors can be
        The power supply is an important part of the circuit and should   linked through a T-type connection to the ground plane
        be handled accordingly. As a rule of thumb, the power supply   using vias near the GND pin of the component rather than
        block must be isolated from the rest of the circuitry and at the   creating a trace. See the sample in Figure 2.
        same time remain close to the components being powered.
           Complex systems with devices that have multiple supply pins
        can use separate power supply blocks dedicated to the analogue
        and digital sections, to avoid noisy digital interference.
           On the other hand, power supply routing should be short,
        direct, and use wide traces to reduce inductance and avoid
        current limitation.

        Decoupling techniques
        Power supply rejection ratio (PSRR) is one of the important
        parameters a designer must consider in achieving target system   Figure 2: A decoupling technique for power supply pins.
        performance. PSRR is the measure of the sensitivity of a device
        with respect to power supply variations, which will eventually   Board layers
        dictate the performance of a given device.             Once component placement and the floor plan have been
           To maintain an optimum PSRR, it is necessary to keep the   set, we can go through the other dimension of the board
        high frequency energy from entering the device. This can be   design, which is commonly referred to as board layers. It is
        done by properly decoupling the power supply of the device   highly recommended that board layers should be considered
        to the low impedance ground plane with a combination of   first before doing the PCB routing as this will determine the
        electrolytic and ceramic capacitors.                   allowable return current paths of the system design.
           The whole concept of correct decoupling is to develop a low   A board layer is the vertical arrangement of the copper
        noise environment in which the circuit can operate. The basic   layers in the board. These layers should manage the currents
        rule is to make it easy for the current to return by providing the   and signal throughout the board.
        shortest path.                                            A visual representation of the board layers is shown in
                                                               Figure 3. Table 1 details a typical 4-layer PCB setup.
        Designers must always check the high frequency filtering
        recommendation of each device. More so, this checklist will
        serve as a guide by providing general decoupling techniques and
        their correct implementation:
        •  While electrolytic capacitors act as charge reservoirs to
           transient currents to minimise low frequency noise on power
           supplies, low inductance ceramic capacitors on the other
           hand reduce high frequency noise. Also, ferrite beads are
           optional but will add extra high frequency noise isolation and
           decoupling.
        •  Decoupling capacitors must be placed as close as possible to
           the power supply pins of the device. These capacitors should
           connect to a large area of low impedance ground plane
           through a via or short trace to minimise additional series   Figure 3: A sample 4-layer PCB.
           inductance.
        •  The smaller capacitor, typically 0.01 μF to 0.1 μF, should be
           placed as close as physically possible to the power pins of   Table 1. Typical 4-Layer PCB
           the device. When the device has several outputs switching   Layer Position   Type of Layer
                                                                1               Digital/analogue signal (top layer)
           at the same time, this placement prevents instabilities. The
           electrolytic capacitor, typically 10 μF to 100 μF, should be   2     Ground
                                                                3               Power plane
           placed no more than 2,5 cm away from the power pin of the
           device.                                              4               Aux signal (bottom layer)


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